Event detail
NEPCON JAPAN
Asijský veletrh pro výzkum a vývoj v elektronice, výrobní a balicí technologie. Obsahuje 6 specializovaných veletrhů: INTERNEPCON JAPAN, ELECTROTEST JAPAN, IC & SENSOR PACKAGING TECHNOLOGY EXPO, ELECTRONIC COMPONENTS & MATERIALS EXPO, PWB - PRINTED WIRING BOARDS EXPO, FINE PROCESS TECHNOLOGY EXPO
24.1. - 26.1.2024
Tokio, Japan
Web: www.nepcon.jp/en
Fields
- Energetics, Electroengineering
- Industry, Technology, Science, Research, Inventions, Technological innovation
- Packaging, paper and printing industry
Organisers
-
RX Japan
18F Shinjuku-Nomura Bldg., 1-26-2 Nishi-Shinjuku Building, Shinjuku-ku
JAPAN - 163-0570 Tokyo
Tel.: +81 3 3349 8501
E-mail: [email protected]
Web: www.rxjapan.jp
We advise double-check the dates and location on the
event's official site
.
